General Information

Established in Jan. 1998.

Pilot run started in June 1998. Mass production will start in April 1999.

Factory location: Tao-Yuan Hsien Taiwan (10km from CKS Airport.)

Capital: USD 6.1 million.

Major investor: Nan-Yang Dyeing & Finishing Corp.-one of the leading public listed companies in Taiwan.

Team members: Average 10+ years working experience in IC packaging, testing and related field.

Land Area: 53,800ft2 Floor space: 60,000 ft2

Mission

To become the world class manufacturer for the packaging and testing of communication semiconductor components.

Promise to be loyal to our customers, respectful to our employees, and friendly to our environment as well as to operate in an honest, secure, and healthy way.

Goal

To be a professional semiconductor assembly and testing service company.

Customer satisfaction oriented services and continuous technology development.

Leave competitors behind through continuous improvement in process and technology, optimized and effective operating and management system.

Quality Policy

Meet customer’s requirements based on the quality-is-everything approach and zero defect determination.

Business Scope

Plastic assembly and testing of semiconductor components.

Ceramic assembly and testing.

Hybrid module assembly and testing.

Custom Package Development.

Turnkey Service capabilities for assembly, test, and tape & reel.